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Issue Date	Title Author(s) Journal	View
2014-07-01	The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect Mun, Ki-Yeung ; Hong, Tae Eun ; Cheon, Taehoon ; Jang, Yujin ; Lim, Byoung-Yong ; Kim, Sunjung ; Kim, Soo-Hyun Thin Solid Films, v.562, pp.118 - 125, 2014-07-01	522
2014-10-15	Growth of highly conformal ruthenium-oxide thin films with enhanced nucleation by atomic layer deposition Park, Ji-Yoon ; Yeo, Seungmin ; Cheon, Taehoon ; Kim, Soo-Hyun ; Kim, Min-Kyu ; Kim, Hyungjun ; Hong, Tae Eun ; Lee, Do-Joong Journal of Alloys and Compounds, v.610, pp.529 - 539, 2014-10-15	610
2013-01	Atomic Layer Deposition of Ru Thin Films Using a Ru(0) Metallorganic Precursor and O-2 Hong, Tae Eun ; Choi, Sang-Hyeok ; Yeo, Seungmin ; Park, Ji-Yoon ; Kim, Soo-Hyun ; Cheon, Taehoon ; Kim, Hoon ; Kim, Min-Kyu ; Kim, Hyungjun ECS Journal of Solid State Science and Technology, v.2, no.3, pp.P47 - P53, 2013-01	448
2019-11	Thickness-dependent electrochemical response of plasma enhanced atomic layer deposited WS2 anodes in Na-ion battery Nandi, Dip K. ; Yeo, Seungmin ; Ansari, Mohd Zahid ; Sinha, Soumyadeep ; Cheon, Taehoon ; Kwon, Jiseok ; Kim, Hyungjun ; Heo, Jaeyeong ; Song, Taeseup ; Kim, Soo-Hyun Elsevier Ltd, 2019-11	567
2019-05	Atomic-Layer-Deposited MoN x Thin Films on Three-Dimensional Ni Foam as Efficient Catalysts for the Electrochemical Hydrogen Evolution Reaction Ramesh, Rahul ; Nandi, Dip K. ; Kim, Tae Hyun ; Cheon, Taehoon ; Oh, Jihun ; Kim, Soo-Hyun American Chemical Society, 2019-05	560
2019-07	Enhanced activity of highly conformal and layered tin sulfide (SnSx) prepared by atomic layer deposition (ALD) on 3D metal scaffold towards high performance supercapacitor electrode Ansari, Mohd Zahid ; Parveen, Nazish ; Nandi, Dip K. ; Ramesh, Rahul ; Ansari, Sajid Ali ; Cheon, Taehoon ; Kim, Soo-Hyun Nature Publishing Group, 2019-07	659
2019-11	Low-Temperature Atomic Layer Deposition of Highly Conformal Tin Nitride Thin Films for Energy Storage Devices Ansari, Mohd Zahid ; Nandi, Dip K. ; Janicek, Petr ; Ansari, Sajid Ali ; Ramesh, Rahul ; Cheon, Taehoon ; Shong, Bonggeun ; Kim, Soo-Hyun ACS Applied Materials & Interfaces, v.11, no.46, pp.43608 - 43621, 2019-11	563
2013-11	Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization Yeo, Seungmin ; Choi, Sang-Hyeok ; Park, Ji-Yoon ; Kim, Soo-Hyun ; Cheon, Taehoon ; Lim, Byoung-Yong ; Kim, Sunjung Elsevier BV, 2013-11	616
2013-05	Characteristics ofMoSe(2) formation during rapid thermal processing ofMo-coated glass Lee, Soobin ; Koo, Jaseok ; Kim, Sammi ; Kim, Soo-Hyun ; Cheon, Taehoon ; Oh, Jong Seok ; Kim, Suk Jin ; Kim, Woo Kyoung Elsevier, 2013-05	483
2012-10	A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects Eom, Tae-Kwang ; Sari, Windu ; Cheon, Taehoon ; Kim, Soo-Hyun ; Kim, Woo Kyoung Elsevier BV, 2012-10	672

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