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Issue Date Title Author(s) Journal View
2014-07-01
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect

Mun, Ki-Yeung ;  Hong, Tae Eun ;  Cheon, Taehoon ;  Jang, Yujin ;  Lim, Byoung-Yong ;  Kim, Sunjung ;  Kim, Soo-Hyun

Thin Solid Films, v.562, pp.118 - 125, 2014-07-01

 498
2014-10-15
Growth of highly conformal ruthenium-oxide thin films with enhanced nucleation by atomic layer deposition

Park, Ji-Yoon ;  Yeo, Seungmin ;  Cheon, Taehoon ;  Kim, Soo-Hyun ;  Kim, Min-Kyu ;  Kim, Hyungjun ;  Hong, Tae Eun ;  Lee, Do-Joong

Journal of Alloys and Compounds, v.610, pp.529 - 539, 2014-10-15

 594
2013-01
Atomic Layer Deposition of Ru Thin Films Using a Ru(0) Metallorganic Precursor and O-2

Hong, Tae Eun ;  Choi, Sang-Hyeok ;  Yeo, Seungmin ;  Park, Ji-Yoon ;  Kim, Soo-Hyun ;  Cheon, Taehoon ;  Kim, Hoon ;  Kim, Min-Kyu ;  Kim, Hyungjun

ECS Journal of Solid State Science and Technology, v.2, no.3, pp.P47 - P53, 2013-01

 429
2019-11
Thickness-dependent electrochemical response of plasma enhanced atomic layer deposited WS2 anodes in Na-ion battery

Nandi, Dip K. ;  Yeo, Seungmin ;  Ansari, Mohd Zahid ;  Sinha, Soumyadeep ;  Cheon, Taehoon ;  Kwon, Jiseok ;  Kim, Hyungjun ;  Heo, Jaeyeong ;  Song, Taeseup ;  Kim, Soo-Hyun

Elsevier Ltd, 2019-11

 556
2019-05
Atomic-Layer-Deposited MoN x Thin Films on Three-Dimensional Ni Foam as Efficient Catalysts for the Electrochemical Hydrogen Evolution Reaction

Ramesh, Rahul ;  Nandi, Dip K. ;  Kim, Tae Hyun ;  Cheon, Taehoon ;  Oh, Jihun ;  Kim, Soo-Hyun

American Chemical Society, 2019-05

 548
2019-07

Enhanced activity of highly conformal and layered tin sulfide (SnSx) prepared by atomic layer deposition (ALD) on 3D metal scaffold towards high performance supercapacitor electrode

Enhanced activity of highly conformal and layered tin sulfide (SnSx) prepared by atomic layer deposition (ALD) on 3D metal scaffold towards high performance supercapacitor electrode

Ansari, Mohd Zahid ;  Parveen, Nazish ;  Nandi, Dip K. ;  Ramesh, Rahul ;  Ansari, Sajid Ali ;  Cheon, Taehoon ;  Kim, Soo-Hyun

Nature Publishing Group, 2019-07

 650
2019-11
Low-Temperature Atomic Layer Deposition of Highly Conformal Tin Nitride Thin Films for Energy Storage Devices

Ansari, Mohd Zahid ;  Nandi, Dip K. ;  Janicek, Petr ;  Ansari, Sajid Ali ;  Ramesh, Rahul ;  Cheon, Taehoon ;  Shong, Bonggeun ;  Kim, Soo-Hyun

ACS Applied Materials & Interfaces, v.11, no.46, pp.43608 - 43621, 2019-11

 553
2013-11
Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization

Yeo, Seungmin ;  Choi, Sang-Hyeok ;  Park, Ji-Yoon ;  Kim, Soo-Hyun ;  Cheon, Taehoon ;  Lim, Byoung-Yong ;  Kim, Sunjung

Elsevier BV, 2013-11

 592
2013-05
Characteristics ofMoSe(2) formation during rapid thermal processing ofMo-coated glass

Lee, Soobin ;  Koo, Jaseok ;  Kim, Sammi ;  Kim, Soo-Hyun ;  Cheon, Taehoon ;  Oh, Jong Seok ;  Kim, Suk Jin ;  Kim, Woo Kyoung

Elsevier, 2013-05

 469
2012-10
A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects

Eom, Tae-Kwang ;  Sari, Windu ;  Cheon, Taehoon ;  Kim, Soo-Hyun ;  Kim, Woo Kyoung

Elsevier BV, 2012-10

 651
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