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Issue Date	Title Author(s) Journal	View
2018-11	Mechanically Guided Post-Assembly of 3D Electronic Systems Kim, Bong Hoon ; Liu, Fei ; Yu, Yongjoon ; Jang, Hokyung ; Xie, Zhaoqian ; Li, Kan ; Lee, Jungyup ; Jeong, Ji Yoon ; Ryu, Arin ; Lee, Yechan ; et al Advanced Functional Materials, v.28, no.48, pp.1 - 10, 2018-11	673
2020-11	Rapidly-Customizable, Scalable 3D-Printed Wireless Optogenetic Probes for Versatile Applications in Neuroscience Lee, Juhyun ; Parker, Kyle E. ; Kawakami, Chinatsu ; Kim, Jenny R. ; Qazi, Raza ; Yea, Junwoo ; Zhang, Shun ; Kim, Choong Yeon ; Bilbily, John ; Xiao, Jianliang ; et al Advanced Functional Materials, v.30, no.46, 2020-11	456
2018-05	Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process Kim, Bong Hoon ; Lee, Jungyup ; Won, Sang Min ; Xie, Zhaoqian ; Chang, Jan-Kai ; Yu, Yongjoon ; Cho, Youn Kyoung ; Jang, Hokyung ; Jeong, Ji Yoon ; Lee, Yechan ; et al ACS Nano, v.12, no.5, pp.4164 - 4171, 2018-05	625
2021-07	Instant, multiscale dry transfer printing by atomic diffusion control at heterogeneous interfaces Heo, Seungkyoung ; Ha, Jeongdae ; Son, Sook Jin ; Choi, In Sun ; Lee, Hyeokjun ; Oh, Saehyun ; Jekal, Janghwan ; Kang, Min Hyung ; Lee, Gil Ju ; Jung, Han Hee ; et al Science Advances, v.7, no.28, 2021-07	484

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