Showing results 1 to 27 of 27
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Eom, Tae-Kwang
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Sari, Windu
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Cheon, Taehoon
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Kim, Soo-Hyun
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Kim, Woo Kyoung
- 2012-10
- Eom, Tae-Kwang. (2012-10). A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects. doi: 10.1016/j.tsf.2012.03.068
- Elsevier BV
- View : 879
- Download : 0
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Son, Yeseul
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Kim, Sang Bok
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Mohapatra, Debananda
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Cheon, Taehoon
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Kim, Soo-Hyun
- 2025-08
- Advanced Science, v.12, no.29
- Wiley
- View : 100
- Download : 0
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Hong, Tae Eun
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Choi, Sang-Hyeok
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Yeo, Seungmin
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Park, Ji-Yoon
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Kim, Soo-Hyun
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Cheon, Taehoon
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Kim, Hoon
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Kim, Min-Kyu
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Kim, Hyungjun
- 2013-01
- Hong, Tae Eun. (2013-01). Atomic Layer Deposition of Ru Thin Films Using a Ru(0) Metallorganic Precursor and O-2. ECS Journal of Solid State Science and Technology, 2(3), P47–P53. doi: 10.1149/2.001303jss
- Electrochemical Society, Inc.
- View : 579
- Download : 0
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Kim, Youn-Hye
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Kotsugi, Yohei
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Cheon, Taehoon
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Ramesh, Rahul
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Kim, Soo-Hyun
- 2021-07-06
- Kim, Youn-Hye. (2021-07-06). Atomic layer deposition of RuO2 using a new metalorganic precursor as a diffusion barrier for Ru interconnect. 24th Annual IEEE International Interconnect Technology Conference, IITC 2021. doi: 10.1109/IITC51362.2021.9537498
- Institute of Electrical and Electronics Engineers Inc.
- View : 131
- Download : 0
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Yeo, Seungmin
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Choi, Sang-Hyeok
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Park, Ji-Yoon
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Kim, Soo-Hyun
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Cheon, Taehoon
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Lim, Byoung-Yong
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Kim, Sunjung
- 2013-11
- Yeo, Seungmin. (2013-11). Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization. doi: 10.1016/j.tsf.2013.03.074
- Elsevier BV
- View : 731
- Download : 0
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Nguyen, Chi Thang
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Gu, Bonwook
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Cheon, Taehoon
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Park, Jeongwoo
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Khan, Mohammad Rizwan
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Kim, Soo-Hyun
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Shong, Bonggeun
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Lee, Han-Bo-Ram
- 2021-06
- Nguyen, Chi Thang. (2021-06). Atomic Layer Modulation of Multicomponent Thin Films through Combination of Experimental and Theoretical Approaches. Chemistry of Materials, 33(12), 4435–4444. doi: 10.1021/acs.chemmater.1c00508
- American Chemical Society
- View : 365
- Download : 0
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Ramesh, Rahul
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Nandi, Dip K.
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Kim, Tae Hyun
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Cheon, Taehoon
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Oh, Jihun
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Kim, Soo-Hyun
- 2019-05
- Ramesh, Rahul. (2019-05). Atomic-Layer-Deposited MoN x Thin Films on Three-Dimensional Ni Foam as Efficient Catalysts for the Electrochemical Hydrogen Evolution Reaction. doi: 10.1021/acsami.8b20437
- American Chemical Society
- View : 862
- Download : 0
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Lee, Soobin
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Koo, Jaseok
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Kim, Sammi
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Kim, Soo-Hyun
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Cheon, Taehoon
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Oh, Jong Seok
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Kim, Suk Jin
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Kim, Woo Kyoung
- 2013-05
- Lee, Soobin. (2013-05). Characteristics ofMoSe(2) formation during rapid thermal processing ofMo-coated glass. doi: 10.1016/j.tsf.2012.10.035
- Elsevier
- View : 640
- Download : 0
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Nam, Taewook
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Lee, Chang Wan
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Cheon, Taehoon
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Lee, Woo Jae
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Kim, Soo-Hyun
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Kwon, Se-Hun
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Lee, Han-Bo-Ram
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Kim, Hyungjun
- 2018-03
- Nam, Taewook. (2018-03). Cobalt titanium nitride amorphous metal alloys by atomic layer deposition. Journal of Alloys and Compounds, 737, 684–692. doi: 10.1016/j.jallcom.2017.12.023
- Elsevier BV
- View : 533
- Download : 0
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Koo, Jaseok
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Kim, Sam Mi
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Cheon, Tae Hoon
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Kim, Soo-Hyun
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Kim, Woo Kyoung
- 2018-03
- Koo, Jaseok. (2018-03). Detailed Visualization of Phase Evolution during Rapid Formation of Cu(InGa)Se-2 Photovoltaic Absorber from Mo/CuGa/In/Se Precursors. Scientific Reports, 8. doi: 10.1038/s41598-018-22214-y
- NATURE PUBLISHING GROUP
- View : 529
- Download : 136
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Nakazawa, Tatsuya
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Kim, Donghyun
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Kim, Jaehyeok
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Kotsugi, Yohei
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Cheon, Taehoon
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Chung, Seung-Min
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Kim, Soo-Hyun
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Kim, Hyungjun
- 2022-09
- Nakazawa, Tatsuya. (2022-09). Development of RuS2 for near-infrared photodetector by atomic layer deposition and post-sulfurization. Rare Metals, 41(9), 3086–3099. doi: 10.1007/s12598-022-02012-2
- University of Science and Technology Beijing
- View : 336
- Download : 0
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Ansari, Mohd Zahid
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Parveen, Nazish
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Nandi, Dip K.
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Ramesh, Rahul
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Ansari, Sajid Ali
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Cheon, Taehoon
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Kim, Soo-Hyun
- 2019-07
- Ansari, Mohd Zahid. (2019-07). Enhanced activity of highly conformal and layered tin sulfide (SnSx) prepared by atomic layer deposition (ALD) on 3D metal scaffold towards high performance supercapacitor electrode. doi: 10.1038/s41598-019-46679-7
- Nature Publishing Group
- View : 1019
- Download : 257
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Lee, Byungchan
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Shim, Seungwon
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Trinh, Ngoc Le
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Patil, Aravind H.
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Nguyen, Chi Thang
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Cheon, Taehoon
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Kim, Soo-Hyun
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Kang, Youngho
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Lee, Han-Bo-Ram
- 2025-10
- Journal of Materials Chemistry C, v.13, no.37, pp.19316 - 19329
- Royal Society of Chemistry
- View : 10
- Download : 0
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Park, Ji-Yoon
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Yeo, Seungmin
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Cheon, Taehoon
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Kim, Soo-Hyun
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Kim, Min-Kyu
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Kim, Hyungjun
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Hong, Tae Eun
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Lee, Do-Joong
- 2014-10-15
- Park, Ji-Yoon. (2014-10-15). Growth of highly conformal ruthenium-oxide thin films with enhanced nucleation by atomic layer deposition. Journal of Alloys and Compounds, 610, 529–539. doi: 10.1016/j.jallcom.2014.04.186
- Elsevier
- View : 784
- Download : 0
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Hong, Tae Eun
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Choi, Sang-Kyung
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Kim, Soo-Hyun
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Cheon, Taehoon
- 2013-04
- Hong, Tae Eun. (2013-04). Growth of Highly Conformal TiCx Films Using Atomic Layer Deposition Technique. Journal of the American Ceramic Society, 96(4), 1060–1062. doi: 10.1111/jace.12289
- Wiley Blackwell
- View : 595
- Download : 0
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Park, Chaehyun
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Kweon, Minjeong
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Mohapatra, Debananda
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Cheon, Taehoon
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Bae, Jong-Seong
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Jeong, Daeyoon
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Jang, Hyunwoo
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Shim, Seungwon
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Park, Young-Bae
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Kang, Youngho
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et al
- 2025-06
- Park, Chaehyun. (2025-06). Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition. Chemistry of Materials, 37(13), 4743–4757. doi: 10.1021/acs.chemmater.5c00557
- American Chemical Society
- View : 1061
- Download : 0
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Mohapatra, Debananda
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Byun, Jeong Eun
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Ansari, Mohd Zahid
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Kim, Haekyoung
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Cheon, Taehoon
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Jang, Jongmoon
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Cho, Young-Rae
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Lee, Jung Woo
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Kim, Soo-Hyun
- 2023-12
- Mohapatra, Debananda. (2023-12). Layer Engineered MXene Empowered Wearable Pressure Sensors for Non-Invasive Vital Human–Machine Interfacing Healthcare Monitoring. Advanced Materials Technologies, 8(24). doi: 10.1002/admt.202301175
- Wiley
- View : 66
- Download : 0
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Eom, Tae-Kwang
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Sari, Windu
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Choi, Kyu-Jeong
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Shin, Woong-Chul
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Kim, Jae Hyun
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Lee, Do-Joong
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Kim, Ki-Bum
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Sohn, Hyunchul
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Kim, Soo-Hyun
- 2009
- Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
- Electrochemical Society
- View : 314
- Download : 0
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Eom, Tae-Kwang
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Sari, Windu
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Choi, Kyu-Jeong
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Shin, Woong-Chul
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Kim, Jae Hyun
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Lee, Do-Joong
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Kim, Ki-Bum
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Sohn, Hyunchul
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Kim, Soo-Hyun
- 2009
- Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
- Electrochemical Society
- View : 874
- Download : 0
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Ansari, Mohd Zahid
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Nandi, Dip K.
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Janicek, Petr
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Ansari, Sajid Ali
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Ramesh, Rahul
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Cheon, Taehoon
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Shong, Bonggeun
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Kim, Soo-Hyun
- 2019-11
- Ansari, Mohd Zahid. (2019-11). Low-Temperature Atomic Layer Deposition of Highly Conformal Tin Nitride Thin Films for Energy Storage Devices. ACS Applied Materials & Interfaces, 11(46), 43608–43621. doi: 10.1021/acsami.9b15790
- American Chemical Society
- View : 842
- Download : 0
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Ansari, Mohd Zahid
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Janicek, Petr
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Park, Ye Jin
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NamGung, Sook
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Cho, Bo Yeon
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Nandi, Dip K.
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Jang, Yujin
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Bae, Jong-Seong
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Hong, Tae Eun
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Cheon, Taehoon
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et al
- 2023-05
- Ansari, Mohd Zahid. (2023-05). Preparation of wafer-scale highly conformalamorphous hafnium dioxide thin films by atomic layer deposition using a thermally stable boratabenzene ligand-containing hafnium precursor. Applied Surface Science, 620. doi: 10.1016/j.apsusc.2023.156834
- Elsevier BV
- View : 196
- Download : 0
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Mohapatra, Debananda
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Shin, Yujin
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Ansari, Mohd Zahid
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Kim, Youn-Hye
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Park, Ye Jin
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Cheon, Taehoon
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Kim, Haekyoung
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Lee, Jung Woo
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Kim, Soo-Hyun
- 2023-04
- Mohapatra, Debananda. (2023-04). Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring. Advanced Science, 10(12). doi: 10.1002/advs.202206355
- John Wiley and Sons Inc
- View : 130
- Download : 31
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Choi, Taejin
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Kim, Seong Dae
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Yeo, Seungmin
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Cheon, Taehoon
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Kim, Soo-Hyun
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Ahn, Jong-Hyun
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Kim, Hyungjun
- 2020-02
- Choi, Taejin. (2020-02). Rate performance enhancement of lithium-ion battery using precise thickness-controllable-carbon-coated titanium dioxide nanowire array electrode via atomic layer deposition. Electrochimica Acta, 334, 135596. doi: 10.1016/j.electacta.2019.135596
- Pergamon Press Ltd.
- View : 719
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Mun, Ki-Yeung
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Hong, Tae Eun
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Cheon, Taehoon
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Jang, Yujin
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Lim, Byoung-Yong
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Kim, Sunjung
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Kim, Soo-Hyun
- 2014-07-01
- Mun, Ki-Yeung. (2014-07-01). The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect. Thin Solid Films, 562, 118–125. doi: 10.1016/j.tsf.2014.03.088
- Elsevier
- View : 710
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Nandi, Dip K.
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Yeo, Seungmin
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Ansari, Mohd Zahid
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Sinha, Soumyadeep
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Cheon, Taehoon
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Kwon, Jiseok
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Kim, Hyungjun
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Heo, Jaeyeong
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Song, Taeseup
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Kim, Soo-Hyun
- 2019-11
- Nandi, Dip K. (2019-11). Thickness-dependent electrochemical response of plasma enhanced atomic layer deposited WS2 anodes in Na-ion battery. doi: 10.1016/j.electacta.2019.134766
- Elsevier Ltd
- View : 792
- Download : 0
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Ramesh, Rahul
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Han, Seungmin
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Nandi, Dip K.
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Sawant, Sandesh Y.
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Kim, Deok Hyun
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Cheon, Taehoon
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Cho, Moo Hwan
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Harada, Ryosuke
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Shigetomi, Toshiyuki
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Suzuki, Kazuharu
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et al
- 2021-02
- Ramesh, Rahul. (2021-02). Ultralow Loading (Single-Atom and Clusters) of the Pt Catalyst by Atomic Layer Deposition Using Dimethyl ((3,4-eta) N,N-dimethyl-3-butene-1-amine-N) Platinum (DDAP) on the High-Surface-Area Substrate for Hydrogen Evolution Reaction. Advanced Materials Interfaces, 8(3), 2001508. doi: 10.1002/admi.202001508
- Wiley-VCH Verlag
- View : 477
- Download : 0
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Kweon, Minjeong
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Park, Chaehyun
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Mohapatra, Debananda
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Kim, Sang Bok
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Bae, Jong-Seong
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Cheon, Taehoon
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Kim, Soo-Hyun
- 2025-08
- Kweon, Minjeong. (2025-08). Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization. Applied Surface Science, 701. doi: 10.1016/j.apsusc.2025.163302
- Elsevier
- View : 60
- Download : 0
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